Project News & Activities
A new HIPE White Paper offers a comprehensive review of gate driver and power module integration technologies for modern power electronics.
HIPE has announced the release of its latest White Paper, “Gate driver and power module integration – Part A: Review of Technologies for Power Electronics”, providing a structured and accessible overview of the technologies enabling today’s high-performance power electronic systems. The document addresses the growing complexity of power electronics across multiple application domains, from consumer products to electric mobility and energy infrastructure. It introduces the fundamental concepts designers must master when developing efficient, reliable and scalable power conversion systems.
Key topics covered in the White Paper include:
-
Power semiconductor technologies, including silicon, silicon carbide, and gallium nitride devices, and the main types of power transistors used in power conversion
-
Gate driving and switching behavior, addressing how power transistors are controlled and the challenges associated with fast and efficient switching
-
Packaging and integration technologies, covering printed circuit boards, insulated metal substrates, advanced substrate solutions, and embedded power devices
-
Applications and design challenges in power electronics, with a focus on automotive systems while highlighting relevance to other industrial sectors
Serving as a foundational reference, the document also prepares the ground for Part B, which will focus on the integration of gate driver circuitry with power modules. Each section concludes with key takeaways and is supported by comparative data and an extensive reference list for further exploration.
The paper is available here: https://www.hipeproject.eu/wp-content/uploads/2025/12/HiPE_White-Paper.pdf