HiPE project shares new insights on thermal management for Next-Gen power electronics

The HiPE project, which is driving innovation in wide bandgap power electronics for the next generation of Battery Electric Vehicles, has published new findings on advanced thermal management strategies. As part of its mission to deliver highly energy-efficient, cost-effective, compact, and modular power electronics solutions, HiPE focuses on improving packaging and cooling technologies to support the performance and reliability of WBG devices.

A recent article, “Evaluating Next-Gen Power Packaging: How Top-Side Cooling Performs,” was featured in Power Systems Design and is now available via the project’s website. The article explores the thermal behavior and performance advantages of top-side cooling compared to traditional bottom-side approaches. It provides an in-depth look at experimental setups, material considerations, and thermal simulation results, all aimed at enabling more compact and thermally efficient power modules suitable for electric vehicle applications.

The full article is available here.